FIVEberry RISC

The FIVEberry evaluation board integrates the powerful, OSM-compatible MSRZFive system-in-package (SiP) based on the Andes AX45MP single 1GHz single core RZ/Five by Renesas.

The module conforms to SGET's OSM standard and offers an LCD controller. It supports 512 MB to 4 GB of DDR4 RAM, SPI-NOR flash and optionally 4 GB of eMMC NAND flash. Interfaces include camera input (MIPI-CSI), display output (Parallel-IF), USB2.0 2ch, SD 2ch, CAN (CAN-FD), and Gigabit Ethernet 2-Channel.

The baseboard developed by Aries for the module also has dual A/D converter modules, making it suitable for applications such as entry-class social infrastructure gateway control and industrial gateway control. The temperature range starts at -25 °C to +85 °C and goes up to -40 °C to +85 °C for industrial environments.

The idea of all Open Standard Modules by the Standardization Group for Embedded Technologies e. V. (SGET) is to create a future proof standard for small-size, low-cost embedded computer modules, combining different characteristics, such as to be completely machine processible during soldering, assembly, and testing.

This has different possible packages for direct PCB soldering without a connector and provides pre-defined soft- and hardware interfaces as well as open-source in soft- and hardware.

This approach allows development, production, and distribution of embedded modules for the most popular MCU32, ARM and x86 architectures to combine the advantages of modular embedded computing with increasing requirements regarding costs, space, and interfaces.

Aries has been driving the adoption of RISC-V in industrial designs as well as ARM-based OSM format boards. "Our new baseboard supports all necessary features to make the first steps with the RISC-V CPU core," stated Andreas Widder, Managing Director of ARIES Embedded.

"This entry-level platform serves an expanded user community to develop and debug drivers and bootloaders, and even use it in prototype setups," he said.

The FIVEberry will be available in Q3 2023.

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